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Laser Stencil
Laser Stencil
Laser Stencil
High precision, ensuring both the positional and dimensional accuracy of the holes on the Stencil. The laser machine itself has high precision, with X and Y axis accuracy up to 3um (the highest precision of domestic optical painting machines is 15um), and repetition accuracy up to 1um. Moreover, because the data is designed using computer files and directly driven by the computer, the possibility of deviation in optical painting and graphic transfer processes is reduced, especially for large format circuit boards. This advantage is even more prominent.
详情介绍


Laser Stencil are processed by laser cutting machines after directly outputting CAD files from computers. They have the following characteristics:

High precision, ensuring both the positional and dimensional accuracy of the holes on the template. The laser machine itself has high precision, with X and Y axis accuracy up to 3um (the highest precision of domestic optical painting machines is 15um), and repetition accuracy up to 1um. Moreover, because the data is designed using computer files and directly driven by the computer, the possibility of deviation in optical painting and graphic transfer processes is reduced, especially for large format circuit boards. This advantage is even more prominent.


The processing cycle is short, with the ability to cut 6000 solder pads and up to 8000 circular holes per hour. Data processing and machining can be done in one go, and templates can be easily obtained. Due to the use of data-driven equipment for direct processing, the process between design and manufacturing is reduced, allowing for rapid response to the market.


Plan control, good quality consistency, not relying on complex chemical formulas and process parameters to control quality. Template production has almost no waste. Meanwhile, the use of laser template printing has a low defect rate, making it suitable for large-scale, automated SMT production needs.


The hole wall is smooth, with a roughness of less than 3um. It can also be made small on the top and large on the bottom by the beam focusing characteristic, with a certain taper, which facilitates the release of solder paste. The volume and shape of solder paste application can be controlled.


No need for chemical solutions, no need for chemical treatment, and no environmental pollution.


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