Guanghong Laser Processing Center offers laser cutting of various ceramics, such as drilling or slotting holes in mature ceramics and raw ceramics.
Processing thickness: 0.05-2.5mm
Minimum opening ratio (width to thickness ratio) 1: one
Cutting edges without cracks or burrs
Fully automatic visual alignment ensures product processing accuracy of+/-0.005mm
No burning or discoloration on the surface
Processing ceramic types:
LTCC Low Temperature Co fired Multilayer Ceramic Substrate (Raw Ceramic)
HTCC high-temperature co fired multilayer ceramics (mature ceramics)
DBC direct copper ceramic substrate
DPC direct copper plated substrate