Applicable to 01005, 0201,  0402/, CSP, uBGA, QFP and other Fine Pitch lead-free solder paste printing are the best choices, which can significantly reduce poor printing such as solder beads, insufficient solder, and empty solder;

Especially suitable for large-scale SMT printing, it can maintain a high yield rate.

◆ Technical indicators:

Hole size accuracy: ± 0.005 mm

Maximum positional deviation: ± 0.010 mm

Thickness error: ± 0.005 mm

Hole wall roughness:< 0.0003 mm

Nickel alloy hardness: 500 ~ 560 Hv

◆ Features:

Smooth hole walls and conical cross-sections are advantageous for solder paste demolding; Electroformed nickel alloy has a low surface energy level, reducing solder paste adhesion;

The surface hardness can reach 500~560HV, which extends the service life of the template;

According to customer requirements, templates with a thickness of 20-300um can be provided; STEP DOWN/STEP UP suitable for connectors and other special requirements.