The COB Stencil is designed to achieve good soldering effect on other solder pads on PCB boards with bonding ICs. This type of Stencil is integrally produced by electroplating method. In addition to the advantages of ordinary electroplating Stencils, the upper surface of the steel mesh at the location of the bonding IC will protrude, forming a hole, effectively protecting the bonding IC from soldering while ensuring that the steel mesh and solder pads at other locations are in close contact during the soldering process, thus achieving good soldering effect. It is best to use a rubber scraper for this type of Stencil.

